포지션 상세
We are seeking a visionary Chief Technology Officer (CTO) or Senior Optical Packaging Engineer to lead the advancement of our polymer-based optical packaging technologies. This strategic leadership role is central to driving innovation in high-performance optical module design, automation, and process development. The successful candidate will spearhead core R&D initiatives, manage cross-functional engineering teams, and play a key role in scaling Lessengers’ manufacturing capabilities in alignment with our global business goals.
This role is ideal for a technical leader who thrives in a fast-paced, entrepreneurial environment and is
passionate about pioneering next-generation packaging solutions for high-speed optical communication
systems.
• Lead the development of polymer-based optical packaging technologies with a strong focus on
process automation, precision assembly, and scalability.
• Define and oversee technical strategy across packaging design, prototyping, and transition to volume
manufacturing.
• Act as a key contributor in the development and optimization of high-precision alignment and
assembly processes for photonic devices.
Team Building & Mentorship
• Mentor and train engineering teams in advanced optical packaging techniques using proprietary tools
and processes.
• Build a high-performance engineering culture driven by innovation, collaboration, and continuous
improvement.
• Provide leadership at the Gwangju site (preferably as its General Manager), setting direction and
ensuring effective operational execution.
Cross-Functional Collaboration
• Partner with the product development and manufacturing teams to translate design concepts into
manufacturable solutions.
• Lead technical communication and reporting activities, including the preparation of documentation
for customers, industry partners, and internal stakeholders.
Quality & Standards Compliance
• Ensure engineering practices meet Lessengers’ Quality Management System and safety standards.
• Promote rigorous testing, calibration, and validation of packaging processes and optoelectronic
assemblies.
• Fiber array attachment to photonic devices
• High-precision alignment, warpage control, and laser coupling
• Characterization of optoelectronic devices and silicon photonic ICs
• Hands-on experience in developing scalable packaging routines and automation protocols.
• Strong understanding of photonic integration and process engineering in a production or prototyping
environment.
This role is ideal for a technical leader who thrives in a fast-paced, entrepreneurial environment and is
passionate about pioneering next-generation packaging solutions for high-speed optical communication
systems.
주요업무
Technology Leadership & Development• Lead the development of polymer-based optical packaging technologies with a strong focus on
process automation, precision assembly, and scalability.
• Define and oversee technical strategy across packaging design, prototyping, and transition to volume
manufacturing.
• Act as a key contributor in the development and optimization of high-precision alignment and
assembly processes for photonic devices.
Team Building & Mentorship
• Mentor and train engineering teams in advanced optical packaging techniques using proprietary tools
and processes.
• Build a high-performance engineering culture driven by innovation, collaboration, and continuous
improvement.
• Provide leadership at the Gwangju site (preferably as its General Manager), setting direction and
ensuring effective operational execution.
Cross-Functional Collaboration
• Partner with the product development and manufacturing teams to translate design concepts into
manufacturable solutions.
• Lead technical communication and reporting activities, including the preparation of documentation
for customers, industry partners, and internal stakeholders.
Quality & Standards Compliance
• Ensure engineering practices meet Lessengers’ Quality Management System and safety standards.
• Promote rigorous testing, calibration, and validation of packaging processes and optoelectronic
assemblies.
자격요건
• Proven experience in optical packaging processes, including:• Fiber array attachment to photonic devices
• High-precision alignment, warpage control, and laser coupling
• Characterization of optoelectronic devices and silicon photonic ICs
• Hands-on experience in developing scalable packaging routines and automation protocols.
• Strong understanding of photonic integration and process engineering in a production or prototyping
environment.
